Heatsinks

Home > Products > Heatsinks

Contact-Btn

Composite Materials for Substrates and Heatsinks

hs_1
Copper Tungsten
hs_2
Copper Molybdenum
hs_3
Aluminum Nitride
hs_4
Copper Diamond
hs_5
Aluminum Silicon Carbide
Sumicrystal CVD Diamond

Semiconductor devices have been continuously improving, and fostering incredible changes in the way we process data, communicate with each other, and interact with technology.  One of the most fundamental necessities in the development of semiconductor devices is the need to dissipate the large amounts of heat that is generated during operation of such devices.  In order to solve this critical problem, Sumitomo Electric has successfully developed a variety of heat sink materials with high thermal conductivity and a unique variety of low thermal expansion rates engineered to best compliment common semiconductor materials.

Contact Us About Heatsinks

Fields with asterisks (*) are required.

refresh
PAGE TOP