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High Density Multi-layer FPC

High Density Multi-layer FPCSumitomo Electric provides high density and rigidized multi-layer FPC which are critical for achieving the driving forces in functional density and size reduction to support current product packaging needs.

We are also able to provide fully assembled interconnects, allowing for fully functional and tested interconnect sub-components.

We recommend that design matters be discussed as soon as possible with our engineering or technical sales staff.

Example of Structure of 4 Layer Printed Wiring Board

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