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FPC for High Density Component Mounting

Sumitomo Electric has developed high volume CSP mounting technology for information and communication market segments where extremely high functional performance and capability are required.

A focus in advanced high density technologies provides the strength in our highly functional product capabilities.

FPC for High Density Component Mounting


Material Composition

 

 

Material

Thickness

1

SR Layer

Photo-sensitive Epoxy Resin

20µm

2

Copper Circuits

Copper

12µm

3

Base Layer

Polyimide

20µm

4

Copper Circuits

Copper+ Through-hole Plating

24µm

5

Adhesive Layer

Thermosetting Epoxy Resin

25µm

6

Cover Layer

Polyimide

12.5µm

CSP Mounted Area

fpc-csp-mounted-area

Structure

fpc-structure

  • Electrical connection between both sides are formed by blind via-holes.
  • All area of one side can be used for parts mounting.

* FPC with a terminal pitch of 0.35mm or smaller is currently being developed.

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